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MACHINE VISION LIGHT

LIBL Series

Illumination that projects light from behind the object to emphasize its silhouette and external shape.

#MachineVisionLighting #AppearanceInspection #TransparentMaterialInspection #LeadFrameInspection
  • LIBL Series
  • LIBL Series
  • LIBL Series
Inspection Applications &
Example Images
Optimal for Silhouette-Based Inspection

By illuminating a uniform planar light from behind the object, the external contour can be clearly separated from the background, enabling high-contrast silhouette detection of shape, dimensions, and positional errors.
→ Most effective for shape, dimension, and alignment inspection.

Highly Uniform Illumination

Thickness variations, pinholes, cracks, and the presence of foreign materials in transparent materials or thin components can be clearly distinguished by differences in transmitted intensity.
→ Suitable for film, sheet, glass, and packaging inspection.

Inspection Using Transmission Characteristics

High background contrast and simplified image structure facilitate edge detection and binarization, enabling stable inspection results even at short exposure times.
→ Easy to apply in high-speed automated production lines.

Simplified Illumination Conditions Reduce Inspection Errors

A structure unaffected by reflected light minimizes variations caused by illumination angle and surface condition.
→ Improves the stability and reliability of inspection algorithms.

Features
Shape and Dimension Inspection
By forming a high-contrast silhouette of the object’s external contour using backlight illumination, length, width, diameter, and spacing tolerances can be measured with high precision.
Appearance Inspection
Clear separation between the background and the object enables stable detection of appearance defects such as deformation, warping, and missing features, regardless of changes in illumination conditions.
Transparent Material Inspection
Thickness non-uniformity, cracks, foreign particles, and blocked holes in transparent materials such as glass, film, and plastics can be clearly distinguished by differences in transmitted light intensity.
Lead Frame Inspection
Pin alignment, pitch, warpage, and incomplete forming of lead frames can be rapidly identified, making it suitable for precision inspection in semiconductor packaging processes.